Item
|
Technical Specification
|
Material Type
|
FR1--1, FR-4, CEM-1, CEM-3, Rogers
|
Material Thickness
|
0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005"
|
Layer count
|
1 to 20 Layers
|
Max. Board Size
|
22.00” x 28.00”
|
IPC Class
|
Class II, Class III
|
Annular Ring
|
5 mil/side or Greater (Min. Design)
|
Finish Plating
|
Solder(HASL), Lead Free Solder(L/F HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nickel, Hard Gold, Other
|
Copper Weight
|
Outer : Up to 7oz, Inner : up to 4 oz.
|
Trace/Space Width
|
3/3 mil
|
Smallest pad size
|
12 mil
|
Plated Slots
|
0.016“
|
Smallest Hole
|
8mil; 4 mil
|
Gold Fingers
|
1 to 4 Edge (30 to 50 Micron Gold)
|
SMD Pitch
|
0.080” - 0.020” - 0.010”
|
Soldermask Type
|
LPI Glossy, LPI-Matte
|
Soldermask Color
|
Green, Red, Blue, Black, White, Yellow, Clear
|
Legend Color
|
White, Yellow, Black, Red, Blue。
|
Minimum Route Width
|
0.031”
|
Scoring(v-cut)
|
Straight Lines, Jump Scoring, CNC V-CUT.
|
Gold
|
HARD, SOFT, IMMERSION (up to 50 MICRON GOLD)
|
Data File Format
|
Gerber RS-274x with embedder aperture.
|
Fab. Drawing Format
|
DXF, HPGL, DWG, PDF, Gerber
|
Aspect Ratio
|
10:01
|
Counter Sink / Counter Bore
|
Yes
|
Control Impedence
|
Yes
|
Blind Vias / Buried Vias
|
Yes
|
Peelable Mask
|
Yes
|
Carbon
|
Yes
|
Item
|
Technical Specification
|
Number of layers
|
Single side, double sides, four layers MCPCB
|
Type of product
|
Aluminum, copper, iron base MCPCB
|
Supplier of laminate
|
Berquist, Thermogan, Totking, Polytronics, Eastpower, Chengyue etc.
|
Finish board thickness
|
0.2~5.0mm
|
Copper thickness
|
Hoz—3oz
|
Supplier of solder mask
|
Taiyo, Fotochem etc.
|
Color of solder mask
|
White, black, red, blue, yellow etc.
|
Surface finish
|
Electrolytic silver, ENIG, immersion tin, immersion silver, OSP, Lead Free HASL etc.
|
Type of finished outline
|
Routing, punching, V-cut
|
Bow and twist
|
≤0.75%
|
Min hole’s size
|
1.0mm
|
Max. board size
|
1200mmX610mm
|
Min. board size
|
10mmX10mm
|