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FR4 capacity:
Item Technical Specification
Material Type FR1--1, FR-4, CEM-1, CEM-3, Rogers
Material Thickness 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005"
Layer count 1 to 20 Layers
Max. Board Size 22.00” x 28.00”
IPC Class Class II, Class III
Annular Ring 5 mil/side or Greater (Min. Design)
Finish Plating Solder(HASL), Lead Free Solder(L/F HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nickel, Hard Gold, Other
Copper Weight Outer : Up to 7oz, Inner : up to 4 oz.
Trace/Space Width 3/3 mil
Smallest pad size 12 mil
Plated Slots 0.016“
Smallest Hole 8mil; 4 mil
Gold Fingers 1 to 4 Edge (30 to 50 Micron Gold)
SMD Pitch 0.080” - 0.020” - 0.010”
Soldermask Type LPI Glossy, LPI-Matte
Soldermask Color Green, Red, Blue, Black, White, Yellow, Clear
Legend Color White, Yellow, Black, Red, Blue。
Minimum Route Width 0.031”
Scoring(v-cut) Straight Lines, Jump Scoring, CNC V-CUT.
Data File Format Gerber RS-274x with embedder aperture.
Fab. Drawing Format DXF, HPGL, DWG, PDF, Gerber
Aspect Ratio 10:01
Counter Sink / Counter Bore Yes
Control Impedence Yes
Blind Vias / Buried Vias Yes
Peelable Mask Yes
Carbon Yes

MCPCB capacity:
Item Technical Specification
Number of layers Single side, double sides, four layers MCPCB
Type of product Aluminum, copper, iron base MCPCB
Supplier of laminate Berquist, Thermogan, Totking, Polytronics, Eastpower, Chengyue etc.
Finish board thickness 0.2~5.0mm
Copper thickness Hoz—3oz
Supplier of solder mask Taiyo, Fotochem etc.
Color of solder mask White, black, red, blue, yellow etc.
Surface finish Electrolytic silver, ENIG, immersion tin, immersion silver, OSP, Lead Free HASL etc.
Type of finished outline Routing, punching, V-cut
Bow and twist ≤0.75%
Min hole’s size 1.0mm
Max. board size 1200mmX610mm
Min. board size 10mmX10mm