Candor Highlights Cutting-edge PCB Manufacturing

 Candor Highlights Cutting-edge PCB Manufacturing

Toronto-based high-technology PCB manufacturer Candor Industries is focussing on the future of circuit board manufacturing through a recent series of successful leading-edge board builds. Candor’s recent achievements include: Manufacture of RO3202 hybrid four-layer with 2.5/2.5 mil space wire bondable traces in 5 days through a simplified process, including acid etch and positive acting 5 micron thick liquid photo resist, allowing for rapid manufacturing fine line RF boards. Laminated Ceramic Alumina with copper foil through low-pressure lamination techniques, eliminating cracking. This technique would allow for board designs that may require internal ceramic layers. Manufactures four-layer Megtron 6 boards with 20 mil edge castellation, 2 mil space, 1.5 mil stringers with 2 mil pads. Without the use of LDI exposing units for layer imaging, Candor produces boards with 4 mil L1-L2, L3-L4, L2-L3 mechanical drilling. Their simplified process does not require expensive exposing and drilling units for complex prototyping thereby being very cost competitive. Manufacture of 12.5”x16” 6 layer Polyimide rigid flex boards with 150C operating temperature. Through Candor’s technical know-how and processes, high temperature requirements with flex/overlay are being met with ease and competitive cost. Candor President Yogen Patel remarks, “We’re extremely excited over the success we’ve had achieving these high-end, technical builds. With the speed at which the industry changes these days, Candor wants to be ahead of the pack, at the forefront of technology.