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2011-7-21 6:54:15
Rigid PCB (High TG) 14 layers FR4 High
2011-7-21 7:23:44
16 layers Rigid PCB FR4 Hoz ENIG
2011-7-21 7:29:12
Flex PCB ENIG 1oz
2011-7-21 7:36:21
lex PCB Polymide Hoz ENIG 0.012″
2011-7-21 7:40:23
8 layers Rigid-Flex PCB ENIG
2011-7-21 7:43:37
Rigid-Flex PCB Polymide+FR4 Hoz 0.063″
2011-7-21 7:45:12
10 layers Rigid-Flex PCB ENIG Polymide+F
2011-7-21 8:05:25
2011-9-16 17:31:15
16layers FR4 Hoz ENIG 0.040″
2011-9-17 20:19:48
2011-9-17 20:54:13
6 layers Polymide+FR4 1/1oz ENIG
2011-9-17 21:01:09
2011-9-17 21:15:34
2011-9-18 6:04:49
16 layers FR4 Hoz 0.100″ ENIG
2011-9-18 6:11:19
6 layers FR4 1oz 0.063″ ENIG+Gold finge
2011-9-18 6:20:45
4 layersFR4 1oz 0.047″ OSP 4/4mil 8mi
2011-9-18 6:28:07
18 layers FR4 Hoz 0.100″ ENIG 4/4mil 4
2011-9-18 6:35:07
18layers FR4 1oz 0.110″ Immersion Sil
2011-9-18 6:51:51
16 layers Rigid PCB (Blind & Buried) F
2013-6-24 10:07:18
8 layers FR4 High TG170 1oz 0.063″ HASL
2013-6-24 10:24:41
2 Layer FR4 2oz 0.078″ ENIG Min.line wi
2013-6-24 10:33:40
4 Layers Rigid PCB(carbon ) FR4 1oz 0.0
2013-6-24 15:08:16
6 layers FR4 High TG150 1oz 0.040″ LF H
2013-6-24 15:17:05
12 layers ISOLA 370HR 1oz 0.063″ ENIG
2013-6-24 15:53:02
4 layers FR4 1oz 0.063″ ENIG Min.line
2013-6-24 16:00:06
8 layers FR4 2oz 0.063″ ENIG+Gold finge
2013-6-24 16:14:20
2013-6-24 16:18:32
2013-6-24 16:22:25
2013-6-24 16:27:55
2013-6-24 16:29:56
2013-6-24 16:32:35
2013-7-10 15:08:58
4 layers FR4 1oz 0.079″ ENIG
2013-7-10 15:15:19
1 layers Aluminum based 1oz 0.062″ OSP
2013-7-10 15:26:01
2 layers Rogers material 1oz 0.062″ EN
2013-7-10 15:31:09
12 layers FR4 TG170 1oz 0.062″ LF HASL
2018-5-5 11:07:58
1layer Aluminum based PCB 1OZ,1.50MM.2W,
2018-5-5 11:20:41
2layers Aluminum based PCB 1OZ 2.00MM 2W
2018-5-5 11:28:27
1layer Copper based PCB 1OZ 1.50MM 2W OS
2018-5-5 11:47:20
1layer Aluminum based PCB 1OZ,1.50MM 2W,
2018-5-7 13:34:50
1layer Aluminum based PCB 1OZ 1.20MM 2W